rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Nanopackaging
    sub title: Nanotechnologies and Electronics Packaging
  name:
    name part: Morris, James E.
    role:
      role term: editor.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: xxu
    date issued: 2008
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: XXI, 543 p. online resource.
  abstract: Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including: The importance of computer modeling in nanopackaging and offers suggestions for implementation Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control A comprehensive overview of nanoscale electronics and systems packaging Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging.
  table of contents: Nanopackaging: Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Application of Molecular Dynamics Simulation in Electronic Packaging -- Advances in Delamination Modeling -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges -- Nanostructured Resistor Materials -- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging -- Nanoconductive Adhesives -- Nanoparticles in Microvias -- Materials and Technology for Conductive Microstructures -- A Study of Nanoparticles in SnAg-Based Lead-Free Solders -- Nano-Underfills for Fine-Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- Carbon Nanotubes for Thermal Management of Microsystems -- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes -- Nanowires in Electronics Packaging -- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging -- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities -- Nanoelectronics Landscape: Application, Technology, and Economy -- Errata.
  note: edited by James E. Morris.
  subject:
    topic: Materials science
  subject:
    topic: Electrochemistry
  subject:
    topic: Electronics
  subject:
    topic: Microelectronics
  subject:
    topic: Nanotechnology
  subject:
    topic: Materials Science
  subject:
    topic: Nanotechnology
  subject:
    topic: Electrochemistry
  subject:
    topic: Electronics and Microelectronics, Instrumentation
  classification: T174.7
  classification: TA418.9.N35
  classification: 620.115
  related item:
    title info:
      title: Springer eBooks
  identifier: 9780387473260
  identifier: http://dx.doi.org/10.1007/978-0-387-47325-3
  record info:
    record creation date: 100301
    record change date: 20151204152524.0
    record identifier: 978-0-387-47326-0