rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
  name:
    name part: Shacham-Diamand, Yosi.
    role:
      role term: editor.
  name:
    name part: Osaka, Tetsuya.
    role:
      role term: editor.
  name:
    name part: Datta, Madhav.
    role:
      role term: editor.
  name:
    name part: Ohba, Takayuki.
    role:
      role term: editor.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: xxu
    date issued: 2009
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: XX, 552 p. online resource.
  abstract: Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.
  table of contents: Challenges in ULSI Interconnects - Introduction to the Book -- Technology Background -- MOS Device and Interconnects Scaling Physics -- Interconnects in ULSI Systems: Cu Interconnects Electrical Performance -- Electrodeposition -- Electrophoretic Deposition -- Wafer-Level 3D Integration for ULSI Interconnects -- Interconnect Materials -- Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization -- Silicides -- Materials for ULSI metallization - Overview of Electrical Properties -- Low-? Materials and Development Trends -- Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects -- ALD Seed Layers for Plating and Electroless Plating -- Deposition Processes for ULSI Interconnects -- Electrochemical Processes for ULSI Interconnects -- Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing -- Electroless Deposition Approaching the Molecular Scale -- Modeling -- Modeling Superconformal Electrodeposition Using an Open Source PDE Solver -- Electrochemical Process Integration -- to Electrochemical Process Integration for Cu Interconnects -- Damascene Concept and Process Steps -- Advanced BEOL Technology Overview -- Lithography for Cu Damascene Fabrication -- Physical Vapor Deposition Barriers for Cu metallization - PVD Barriers -- Low-k Dielectrics -- CMP for Cu Processing -- Electrochemical View of Copper Chemical-Mechanical Polishing (CMP) -- Copper Post-CMP Cleaning -- Electrochemical Processes and Tools -- Electrochemical Processing Tools for Advanced Copper Interconnects: An Introduction -- Electrochemical Deposition Processes and Tools -- Electroless Deposition Processes and Tools -- Tools for Monitoring and Control of Bath Components -- Processes and Tools for Co Alloy Capping -- Advanced Planarization Techniques -- Metrology -- Integrated Metrology (IM) History at a Glance -- Thin Film Metrology - X-ray Methods -- Summary and Foresight -- Emerging Nanoscale Interconnect Processing Technologies: Fundamental and Practice -- Self-…
  note: edited by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba.
  subject:
    topic: Chemistry
  subject:
    topic: Electrochemistry
  subject:
    topic: Chemical engineering
  subject:
    topic: Electrical engineering
  subject:
    topic: Materials science
  subject:
    topic: Nanotechnology
  subject:
    topic: Chemistry
  subject:
    topic: Electrochemistry
  subject:
    topic: Materials Science, general
  subject:
    topic: Industrial Chemistry/Chemical Engineering
  subject:
    topic: Electrical Engineering
  subject:
    topic: Nanotechnology
  classification: QD551-578
  classification: 541.37
  related item:
    title info:
      title: Springer eBooks
  identifier: 9780387958682
  identifier: http://dx.doi.org/10.1007/978-0-387-95868-2
  record info:
    record creation date: 100301
    record change date: 20151028141839.0
    record identifier: 978-0-387-95868-2