rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    non sort: The
    title: ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
  name:
    name part: Grossmann, Günter.
    role:
      role term: editor.
  name:
    name part: Zardini, Christian.
    role:
      role term: editor.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: xxk
    date issued: 2011
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: VIII, 313 p. online resource.
  abstract: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
  table of contents: 1. Deformation and Fatigue of Solders -- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints -- 3. Thermal Fatigue Analysis -- 4. Electrochemical Behavior of Solder Alloys -- 5. Void Formation by Kirkendall Effect in Solder Joints -- 6. Tin Whiskers -- 7. Electromigration in Solder Interconnects -- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold -- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading -- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration -- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates -- 12. PCB Delamination -- 13. Excessive Warpage of Large Packages during Reflow Soldering -- 14. Popcorn Cracking -- 15. Thermal Capability of Components.
  note: edited by Günter Grossmann, Christian Zardini.
  subject:
    topic: Engineering
  subject:
    topic: Quality control
  subject:
    topic: Reliability
  subject:
    topic: Industrial safety
  subject:
    topic: Electronics
  subject:
    topic: Microelectronics
  subject:
    topic: Optical materials
  subject:
    topic: Electronic materials
  subject:
    topic: Materials science
  subject:
    topic: Engineering
  subject:
    topic: Electronics and Microelectronics, Instrumentation
  subject:
    topic: Optical and Electronic Materials
  subject:
    topic: Quality Control, Reliability, Safety and Risk
  subject:
    topic: Characterization and Evaluation of Materials
  classification: TK7800-8360
  classification: TK7874-7874.9
  classification: 621.381
  related item:
    title info:
      title: Springer eBooks
  identifier: 9780857292360
  identifier: http://dx.doi.org/10.1007/978-0-85729-236-0
  record info:
    record creation date: 110512
    record change date: 20151125193419.0
    record identifier: 978-0-85729-236-0