rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Fundamentals of Lead-Free Solder Interconnect Technology
    sub title: From Microstructures to Reliability
  name:
    name part: Lee, Tae-Kyu.
    role:
      role term: creator
    role:
      role term: author.
  name:
    name part: Bieler, Thomas R.
    role:
      role term: author.
  name:
    name part: Kim, Choong-Un.
    role:
      role term: author.
  name:
    name part: Ma, Hongtao.
    role:
      role term: author.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: xxu
    date issued: 2015
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: XIII, 253 p. 151 illus., 81 illus. in color. online resource.
  abstract: This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering.
  table of contents: Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
  note: by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
  subject:
    topic: Engineering
  subject:
    topic: Electronics
  subject:
    topic: Microelectronics
  subject:
    topic: Electronic circuits
  subject:
    topic: Optical materials
  subject:
    topic: Electronic materials
  subject:
    topic: Engineering
  subject:
    topic: Electronics and Microelectronics, Instrumentation
  subject:
    topic: Optical and Electronic Materials
  subject:
    topic: Circuits and Systems
  classification: TK7800-8360
  classification: TK7874-7874.9
  classification: 621.381
  related item:
    title info:
      title: Springer eBooks
  identifier: 9781461492665
  identifier: http://dx.doi.org/10.1007/978-1-4614-9266-5
  record info:
    record creation date: 141105
    record change date: 20151204190650.0
    record identifier: 978-1-4614-9266-5