rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Carbon Nanotubes for Interconnects
    sub title: Process, Design and Applications
  name:
    name part: Todri-Sanial, Aida.
    role:
      role term: editor.
  name:
    name part: Dijon, Jean.
    role:
      role term: editor.
  name:
    name part: Maffucci, Antonio.
    role:
      role term: editor.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: gw
    date issued: 2017
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: XII, 333 p. 167 illus., 133 illus. in color. online resource.
  abstract: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
  table of contents: Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.
  note: edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.
  subject:
    topic: Engineering
  subject:
    topic: Microprocessors
  subject:
    topic: Electronic circuits
  subject:
    topic: Engineering
  subject:
    topic: Circuits and Systems
  subject:
    topic: Processor Architectures
  subject:
    topic: Electronic Circuits and Devices
  classification: TK7888.4
  classification: 621.3815
  related item:
    title info:
      title: Springer eBooks
  identifier: 9783319297460
  identifier: http://dx.doi.org/10.1007/978-3-319-29746-0
  record info:
    record creation date: 160709
    record change date: 20160709092829.0
    record identifier: 978-3-319-29746-0