rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: 3D Microelectronic Packaging
    sub title: From Fundamentals to Applications
  name:
    name part: Li, Yan.
    role:
      role term: editor.
  name:
    name part: Goyal, Deepak.
    role:
      role term: editor.
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: gw
    date issued: 2017
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: IX, 463 p. 331 illus., 253 illus. in color. online resource.
  abstract: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.
  table of contents: Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. .
  note: edited by Yan Li, Deepak Goyal.
  subject:
    topic: Engineering
  subject:
    topic: Biotechnology
  subject:
    topic: Electronic circuits
  subject:
    topic: Nanotechnology
  subject:
    topic: Electronics
  subject:
    topic: Microelectronics
  subject:
    topic: Optical materials
  subject:
    topic: Electronic materials
  subject:
    topic: Metals
  subject:
    topic: Engineering
  subject:
    topic: Electronics and Microelectronics, Instrumentation
  subject:
    topic: Optical and Electronic Materials
  subject:
    topic: Electronic Circuits and Devices
  subject:
    topic: Microengineering
  subject:
    topic: Nanotechnology and Microengineering
  subject:
    topic: Metallic Materials
  classification: TK7800-8360
  classification: TK7874-7874.9
  classification: 621.381
  related item:
    title info:
      title: Springer eBooks
  related item:
    title info:
      title: Springer Series in Advanced Microelectronics, 57
  identifier: 9783319445861
  identifier: http://dx.doi.org/10.1007/978-3-319-44586-1
  record info:
    record creation date: 170125
    record change date: 20170125052033.0
    record identifier: 978-3-319-44586-1