rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Contactless VLSI Measurement and Testing Techniques
  name:
    name part: Sayil, Selahattin.
    role:
      role term: creator
    role:
      role term: author.
    role:
      role term: aut
    role:
      role term: http://id.loc.gov/vocabulary/relators/aut
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: gw
    date issued: 2018
    edition: 1st ed. 2018.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: V, 93 p. 34 illus., 11 illus. in color. online resource.
  abstract: This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.
  table of contents: 1. Conventional Test Methods. - 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.
  note: by Selahattin Sayil.
  subject:
    topic: Electronic circuits
  subject:
    topic: Microprocessors
  subject:
    topic: Electronics
  subject:
    topic: Microelectronics
  subject:
    topic: Circuits and Systems
  subject:
    topic: Processor Architectures
  subject:
    topic: Electronics and Microelectronics, Instrumentation
  classification: TK7888.4
  classification: 621.3815
  related item:
    title info:
      title: Springer eBooks
  identifier: 9783319696737
  identifier: https://doi.org/10.1007/978-3-319-69673-7
  record info:
    record creation date: 171116
    record change date: 20191026021719.0
    record identifier: 978-3-319-69673-7