rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
    sub title: Materials, Processes, Equipment, and Reliability
  name:
    name part: Siow, Kim S.
    role:
      role term: editor.
    role:
      role term: edt
    role:
      role term: http://id.loc.gov/vocabulary/relators/edt
  name:
    name part: SpringerLink (Online service)
  type of resource: text
  origin info:
    place:
      place term: gw
    date issued: 2019
    edition: 1st ed. 2019.
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: electronic
    form: electronic resource
    reformatting quality: access
    form: remote
    extent: XX, 279 p. 175 illus., 122 illus. in color. online resource.
  abstract: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
  table of contents: Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison -- Chapter 2: Sintered Silver for LED Applications -- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications -- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials -- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint -- Chapter6: Morphological changes in sintered silver due to atomic migration -- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials -- Chapter 8: Sintered Copper : Chemistry, Process and Reliability -- Chapter 9: Transient Liquid Phase Bonding -- Chapter 10: Die attach materials for extreme conditions and harsh environments.
  note: edited by Kim S. Siow.
  subject:
    topic: Optical materials
  subject:
    topic: Electronic materials
  subject:
    topic: Electronics
  subject:
    topic: Microelectronics
  subject:
    topic: Metals
  subject:
    topic: Materials science
  subject:
    topic: Engineering-Materials
  subject:
    topic: Quality control
  subject:
    topic: Reliability
  subject:
    topic: Industrial safety
  subject:
    topic: Optical and Electronic Materials
  subject:
    topic: Electronics and Microelectronics, Instrumentation
  subject:
    topic: Metallic Materials
  subject:
    topic: Characterization and Evaluation of Materials
  subject:
    topic: Materials Engineering
  subject:
    topic: Quality Control, Reliability, Safety and Risk
  classification: TA1750-1750.22
  classification: 620.11295
  classification: 620.11297
  related item:
    title info:
      title: Springer eBooks
  identifier: 9783319992563
  identifier: https://doi.org/10.1007/978-3-319-99256-3
  record info:
    record creation date: 190129
    record change date: 20191022021612.0
    record identifier: 978-3-319-99256-3