rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Modeling and simulation for microelectronic packaging assembly
    sub title: manufacture, reliability, and testing
  name:
    name part: Liu, S. (Sheng)
    name part: 1963-
    role:
      role term: creator
  name:
    name part: Liu, Yong
    name part: 1962-
  name:
    name part: Wiley InterScience (Online service)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: nju
    date issued: 2011
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxi, 564 pages) : illustrations (some color)
  abstract: "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
  table of contents: Front Matter -- Mechanics and Modeling. Constitutive Models and Finite Element Method -- Material and Structural Testing for Small Samples -- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution -- Accelerated Fatigue Life Assessment Approaches for Solders in Packages -- Multi-Physics and Multi-Scale Modeling -- Modeling Validation Tools -- Application of Fracture Mechanics -- Concurrent Engineering for Microelectronics -- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes -- Opto Packaging and Assembly -- MEMS and MEMS Package Assembly -- System in Package (SIP) Assembly -- Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test -- Power and Thermal Cycling, Solder Joint Fatigue Life -- Passivation Crack Avoidance -- Drop Test -- Electromigration -- Popcorning in Plastic Packages -- Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics -- Index.
  note: Sheng Liu, Yong Liu.
  note: Electronic reproduction. Hoboken, N.J. : Wiley InterScience, 2011. Mode of access: World Wide Web. System requirements: Web browser. Title from title screen (viewed on Oct. 4, 2011). Access may be restricted to users at subscribing institutions.
  note: Includes bibliographical references and index.
  subject:
    topic: Microelectronic packaging
    topic: Simulation methods
  subject:
    topic: TECHNOLOGY & ENGINEERING
    topic: Electronics
    topic: Circuits
    topic: General
  classification: TK7870.15 .L58 2011eb
  classification: 621.381/046
  related item:
    title info:
      title: Modeling and simulation for microelectronic packaging assembly
    name:
      name part: Liu, S. (Sheng), 1963-
    origin info:
      publisher: Hoboken, N.J. : Wiley, 2011
    identifier: (DLC) 2011019534
    identifier: (OCoLC)699765387
  identifier: 9780470827826
  identifier: 0470827823
  identifier: 10.1002/9780470827826 Wiley InterScience
  identifier: https://doi.org/10.1002/9780470827826
  record info:
    record content source: DG1
    record creation date: 111018
    record change date: 20170124071714.5
    record identifier: ocn757511518
    language of cataloging:
      language term: eng