http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Modeling and simulation for microelectronic packaging assembly
1 online resource (xxi, 564 pages) : illustrations (some color)
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation."--
Front Matter -- Mechanics and Modeling. Constitutive Models and Finite Element Method -- Material and Structural Testing for Small Samples -- Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution -- Accelerated Fatigue Life Assessment Approaches for Solders in Packages -- Multi-Physics and Multi-Scale Modeling -- Modeling Validation Tools -- Application of Fracture Mechanics -- Concurrent Engineering for Microelectronics -- Modeling in Microelectronic Packaging and Assembly. Typical IC Packaging and Assembly Processes -- Opto Packaging and Assembly -- MEMS and MEMS Package Assembly -- System in Package (SIP) Assembly -- Modeling in Microelectronic Package Reliability and Test. Wafer Probing Test -- Power and Thermal Cycling, Solder Joint Fatigue Life -- Passivation Crack Avoidance -- Drop Test -- Electromigration -- Popcorning in Plastic Packages -- Modern Modeling and Simulation Methodologies: Application to Nano Packaging. Classical Molecular Dynamics -- Index.
Electronic reproduction. Hoboken, N.J. : Wiley InterScience, 2011. Mode of access: World Wide Web. System requirements: Web browser. Title from title screen (viewed on Oct. 4, 2011). Access may be restricted to users at subscribing institutions.
Includes bibliographical references and index.