rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: Electrical modeling and design for 3D system integration
    sub title: 3D integrated circuits and packaging, signal integrity, power integrity and EMC
  name:
    name part: Li, Er-Ping.
    role:
      role term: creator
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: xxu
    date issued: 2012
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xiv, 366 pages) : illustrations (some color)
  abstract: "The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants"--
  abstract: "The book attempts to systematically present a series of fast efficient electromagnetic modeling techniques to readers involved in the design and analysis of the large and complex electronic structures. The book will present a number of special methods to solve the SI, PI, and EMI problems. The book will provide an overview of the existing electromagnetic modeling methods used in electronic chips, package and PCB, and address the limitations individuals in the real-world engineering community face"--
  table of contents: Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
  note: Er-Ping Li.
  note: Includes bibliographical references and index.
  subject:
    topic: Three-dimensional integrated circuits
  subject:
    topic: Electrical modeling
  subject:
    topic: Electronics
    topic: Mathematical models
  subject:
    topic: Electrical engineering
  subject:
    topic: Physics
  subject:
    topic: Science
  subject:
    topic: Engineering
  subject:
    topic: TECHNOLOGY & ENGINEERING
    topic: Electrical
  subject:
    topic: Three-dimensional integrated circuits
  classification: TK7874.893 .L53 2012
  classification: 621.3815
  classification: TEC008050
  related item:
    title info:
      title: Electrical modeling and design for 3D system integration
    name:
      name part: Li, Er-Ping.
    origin info:
      publisher: Hoboken, N.J. : Wiley-IEEE Press, ©2012
    identifier: (DLC) 2011028946
    identifier: (OCoLC)694396545
  identifier: 9781118166727
  identifier: 1118166728
  identifier: 9781118166758
  identifier: 1118166752
  identifier: 9780470623466
  identifier: 0470623462
  identifier: 10.1002/9781118166727 Wiley InterScience
  identifier: https://doi.org/10.1002/9781118166727
  record info:
    record content source: DG1
    record creation date: 120504
    record change date: 20170124070414.1
    record identifier: ocn793103961
    language of cataloging:
      language term: eng