rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: High-k gate dielectrics for CMOS technology
  name:
    name part: He, Gang
    name part: (Professor of physics)
  name:
    name part: Sun, Zhaoqi
    name part: (Professor of physics)
  type of resource: text
  genre: bibliography
  genre: Electronic books.
  origin info:
    place:
      place term: gw
    date issued: 2012
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxxi, 558 pages) : illustrations (some color)
  abstract: "A state-of-the-art overview of high-k dielectric materials for advanced field-effect transistors, from both a fundamental and a technological viewpoint, summarizing the latest research results and development solutions. As such, the book clearly discusses the advantages of these materials over conventional materials and also addresses the issues that accompany their integration into existing production technologies. Topics covered include downscaling limits of current transistor designs, deposition techniques for high-k dielectric materials, electrical characterization of the resulting devices, and an outlook towards future transistor stacking technology. Aimed at academia and industry alike, this monograph combines introductory parts for newcomers to the field as well as advanced sections with directly applicable solutions for experienced researchers and developers in materials science, physics and electrical engineering."--
  table of contents: High-k Gate Dielectrics for CMOS Technology; Contents; Preface; List of Contributors; Color Plates; Part One Scaling and Challenge of Si-based CMOS; 1 Scaling and Limitation of Si-based CMOS; 1.1 Introduction; 1.2 Scaling and Limitation of CMOS; 1.2.1 Device Scaling and Power Dissipation; 1.2.2 Gate Oxide Tunneling; 1.2.3 Gate Oxide Scaling Trends; 1.2.4 Scaling and Limitation of SiO2 Gate Dielectrics; 1.2.5 Silicon Oxynitrides; 1.3 Toward Alternative Gate Stacks Technology; 1.3.1 Advances and Challenges in Dielectric Development; 1.3.2 Advances and Challenges in Electrode Development.
  table of contents: 1.4 Improvements and Alternative to CMOS Technologies1.4.1 Improvement to CMOS; 1.4.1.1 New Materials; 1.4.1.2 New Structures; 1.5 Potential Technologies Beyond CMOS; 1.6 Conclusions; References; Part Two High-k Deposition and Materials Characterization; 2 Issues in High-k Gate Dielectrics and its Stack Interfaces; 2.1 Introduction; 2.2 High-k Dielectrics; 2.2.1 The Criteria Required for High-k Dielectrics; 2.2.2 The Challenges of High-k Dielectrics; 2.2.2.1 Structural Defects; 2.2.2.2 Channel Mobility Degradation; 2.2.2.3 Threshold Voltage Control; 2.2.2.4 Reliability; 2.3 Metal Gates.
  table of contents: 2.3.1 Basic Requirements for Metal Gates2.3.2 Metal Gate Materials; 2.3.2.1 Pure Metals; 2.3.2.2 Metallic Alloys; 2.3.2.3 Metal Nitrides; 2.3.2.4 Metal Silicides; 2.3.3 Work Function; 2.3.4 Metal Gate Structures; 2.3.5 Metal Gate/High-k Integration; 2.3.6 Process Integration; 2.4 Integration of High-k Gate Dielectrics with Alternative Channel Materials; 2.4.1 High-k/Ge Interface; 2.4.2 High-k/III-V Interface; 2.5 Summary; References; 3 UV Engineering of High-k Thin Films; 3.1 Introduction; 3.2 Gas Discharge Generation of UV (Excimer) Radiation.
  table of contents: 3.3 Excimer Lamp Sources Based on Silent Discharges3.4 Predeposition Surface Cleaning for High-k Layers; 3.5 UV Photon Deposition of Ta2O5 Films; 3.6 Photoinduced Deposition of Hf1-xSixOy Layers; 3.7 Summary; References; 4 Atomic Layer Deposition Process of Hf-Based High-k Gate Dielectric Film on Si Substrate; 4.1 Introduction; 4.2 Precursor Effect on the HfO2 Characteristics; 4.2.1 Hafnium Precursor Effect on the HfO2 Dielectric Characteristics; 4.2.1.1 Hafnium Chloride (HfCl4); 4.2.1.2 Tetrakis Dimethylamido Hafnium [HfN(CH3)2]4; 4.2.1.3 Tetrakis Ethylmethylamino Hafnium (Hf[N(C2H5)(CH3)]4).
  table of contents: 4.2.1.4 tert-Butoxytris[Ethylmethylamido] Hafnium (HfOtBu[NEtMe]3)4.2.1.5 tert-Butoxide Hafnium (Hf[OC4H9]4); 4.2.2 Oxygen Sources and Reactants; 4.2.2.1 H2O versus O3; 4.2.2.2 O3 Concentration; 4.2.2.3 Reactants for In Situ N Incorporation; 4.3 Doped and Mixed High-k; 4.3.1 Zr-Doped HfO2; 4.3.2 Si-Doped HfO2; 4.3.3 Al-Doped HfO2; 4.4 Summary; References; 5 Structural and Electrical Characteristics of Alternative High-k Dielectrics for CMOS Applications; 5.1 Introduction; 5.2 Requirement of High-k Oxide Materials; 5.3 Rare-Earth Oxide as Alternative Gate Dielectrics; 5.4 Structural Characteristics of High-k RE Oxide Films.
  note: edited by Gang He and Zhaoqi Sun.
  note: Includes bibliographical references and index.
  subject:
    topic: Dielectrics
  subject:
    topic: Metal oxide semiconductors, Complementary
  subject:
    topic: SCIENCE
    topic: Physics
    topic: Electricity
  subject:
    topic: SCIENCE
    topic: Physics
    topic: Electromagnetism
  subject:
    topic: Dielectrics
  subject:
    topic: Metal oxide semiconductors, Complementary
  classification: QC585 .H54 2012
  classification: 537/.24
  related item:
    title info:
      title: High-k gate dielectrics for CMOS technology
    origin info:
      publisher: Weinheim :
      edition: Wiley-VCH, ©2012
    identifier: (OCoLC)785081747
  identifier: 9783527646340
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  identifier: https://doi.org/10.1002/9783527646340
  record info:
    record content source: EBLCP
    record creation date: 120709
    record change date: 20170124065920.4
    record identifier: ocn798536325
    language of cataloging:
      language term: eng