Diffusion bonding 2 /

• Corporate Author: International Conference on Diffusion Bonding Cranfield Institute of Technology
• Other Authors: Stephenson, D. J. (David J.) (επιμελητής.)
• Format: Conference Proceeding Book
• Language: English
• Published: London ; New York : New York, NY, USA : Elsevier Applied Science ; Sole distributor in the USA and Canada, Elsevier Science Pub. Co., 1991.
• Subjects: Συγκόλληση μετάλλων