Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections

Εμφάνιση άλλων εκδόσεων (1)

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας:	Greig, William J.
Μορφή:	Ηλεκτρονική πηγή Εργαλειοθήκη Βιβλίο
Γλώσσα:	English
Έκδοση:	Boston, MA Springer Science+Business Media LLC 2007
Θέματα:	Engineering Electronics Systems engineering Engineering design Optical materials Electronics and Microelectronics, Instrumentation Circuits and Systems Engineering Design Optical and Electronic Materials
Διαθέσιμο Online:	http://dx.doi.org/10.1007/0-387-33913-2

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