Integrated Circuit Packaging, Assembly and Interconnections

• Κύριος συγγραφέας: Greig, William J.
• Μορφή: Ηλεκτρονική πηγή Εργαλειοθήκη Βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA Springer Science+Business Media LLC 2007
• Θέματα: Engineering; Electronics; Systems engineering; Engineering design; Optical materials; Electronics and Microelectronics, Instrumentation; Circuits and Systems; Engineering Design; Optical and Electronic Materials