Force Sensors for Microelectronic Packaging Applications
Main Author: | Schwizer, JΓΌrg |
---|---|
Other Authors: | Mayer, Michael, Brand, Oliver |
Format: | Electronic Kit Book |
Language: | English |
Published: |
Berlin, Heidelberg
Springer-Verlag Berlin Heidelberg
2005
|
Series: | Microtechnology and MEMS
|
Subjects: | |
Online Access: | http://dx.doi.org/10.1007/b138345 |
Similar Items
-
CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
by: Li, Flora M.
Published: (2005) -
Gallium Nitride Processing for Electronics, Sensors and Spintronics
by: Pearton, Stephen J.
Published: (2006) -
A Guide to Lead-free Solders Physical Metallurgy and Reliability
by: Evans, John W.
Published: (2007) -
Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
by: Kasper, Erich
Published: (2005) -
Continuous-Time Sigma-Delta A/D Conversion Fundamentals, Performance Limits and Robust Implementations
by: Ortmanns, Maurits
Published: (2006)