Reflow soldering processes SMT, BGA, CSP and flip chip technologies
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared towa...
| Κύριος συγγραφέας: | |
|---|---|
| Συγγραφή απο Οργανισμό/Αρχή: | |
| Μορφή: | Ηλεκτρονική πηγή Βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Boston
Newnes
c2002
|
| Θέματα: | |
| Διαθέσιμο Online: | An electronic book accessible through the World Wide Web; click for information |
