Reflow soldering processes SMT, BGA, CSP and flip chip technologies

• Main Author: Lee, Ning-Cheng
• Corporate Author: ScienceDirect (Online service)
• Format: Electronic Book
• Language: English
• Published: Boston Newnes c2002
• Subjects: Electronic apparatus and appliances > Design and construction; Electronic packaging; Electric connectors

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared towa...