RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

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Bibliographic Details
Main Author: Kuang, Ken
Corporate Author: SpringerLink (Online service)
Other Authors: Kim, Franklin, Cahill, Sean S.
Format: Electronic Kit Book
Language:English
Published: Boston, MA Springer-Verlag US 2010
Subjects:
Engineering
Microwaves
Electronics
Systems engineering
Electronics and Microelectronics, Instrumentation
Microwaves, RF and Optical Engineering
Circuits and Systems
Online Access:http://dx.doi.org/10.1007/978-1-4419-0984-8

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