APA (7th ed.) Citation

Tummala, R. R., RYMASZEWSKI, E. J., & KLOPFENSTEIN, A. G. (1997). Microelectronics Packaging Handbook: Subsystems Packaging (2nd ed.). Kluwer Academic Publishers.

Chicago Style (17th ed.) Citation

Tummala, Rao R., EUGENE J. RYMASZEWSKI, and ALAN G. KLOPFENSTEIN. Microelectronics Packaging Handbook: Subsystems Packaging. 2nd ed. Boston: Kluwer Academic Publishers, 1997.

MLA (8th ed.) Citation

Tummala, Rao R., et al. Microelectronics Packaging Handbook: Subsystems Packaging. 2nd ed. Kluwer Academic Publishers, 1997.