Microelectronics Packaging Handbook Subsystems Packaging

• Other Authors: Tummala, Rao R., 1942- (Editor), RYMASZEWSKI, EUGENE J. (Editor), KLOPFENSTEIN, ALAN G. (Editor)
• Format: Book
• Language: Greek
• Published: Boston Kluwer Academic Publishers 1997
• Edition: 2nd ed.
• Subjects: Μικροηλεκτρονική; HANDBOOK
• Physical Description: III - xxix, III-4 - III-628, p. fig., tab.
• Bibliography: Glossary and Symbols pp. III - 529- III574, Authors' Biographies pp. III-575 - III- 596, Index pp. III-597 - III-628
• ISBN: 0 412 08451 1