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999 |
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020 |
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|a 0 412 08451 1
|
040 |
|
|
|a Βιβλιοθήκη ΕΑΙΤΥ
|c Βιβλιοθήκη ΕΑΙΤΥ
|
040 |
|
|
|a XX-XxUND
|c Βιβλιοθήκη ΕΑΙΤΥ
|
082 |
0 |
4 |
|a 621.381 046
|
245 |
1 |
0 |
|a Microelectronics Packaging Handbook
|b Subsystems Packaging
|c Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein Eds.
|
250 |
|
|
|a 2nd ed.
|
260 |
|
|
|a Boston
|b Kluwer Academic Publishers
|c 1997
|
300 |
|
|
|a III - xxix, III-4 - III-628, p.
|c fig., tab.
|
504 |
|
|
|a Glossary and Symbols pp. III - 529- III574, Authors' Biographies pp. III-575 - III- 596, Index pp. III-597 - III-628
|
505 |
1 |
|
|a Table of Contents: Foreword, Preface, Conversion factors, Summary contents, PART 3:MICROELECTRONICS PACKAGING HANDBOOK: SUBSYSTEM PACKAGING, 15.Microelectronics packaging- an overview, 16.Package-to-board interconnections, 17.Printed-wiring board packaging, 18.Coated-metal packaging, 19.Connector and cable packaging, 20.Packaging of optoelectronics with electronics, Glossary and symbols, Authors' biographies, Index.
|
650 |
|
4 |
|a Μικροηλεκτρονική
|9 724
|
650 |
|
4 |
|a HANDBOOK
|9 22404
|
650 |
|
4 |
|a Μικροηλεκτρονική
|9 724
|
700 |
1 |
|
|a Tummala, Rao R.,
|d 1942-
|4 edt
|9 127350
|
700 |
1 |
|
|a RYMASZEWSKI, EUGENE J.
|4 edt
|9 127352
|
700 |
1 |
|
|a KLOPFENSTEIN, ALAN G.
|4 edt
|9 127353
|
852 |
|
|
|a GR-PaULI
|b ΠΑΤΡΑ
|b ΤΜΗΥΠ
|h 621.381 046 TUM
|t 1
|
852 |
|
|
|a GR-PaULI
|b ΠΑΤΡΑ
|b ΤΜΗΥΠ
|h 621.381 046 TUM
|t 2
|
942 |
|
|
|2 ddc
|c BK15
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