Microelectronics Packaging Handbook Subsystems Packaging

Bibliographic Details
Other Authors: Tummala, Rao R., 1942- (Editor), RYMASZEWSKI, EUGENE J. (Editor), KLOPFENSTEIN, ALAN G. (Editor)
Format: Book
Language:Greek
Published: Boston Kluwer Academic Publishers 1997
Edition:2nd ed.
Subjects:

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