Microelectronics Packaging Handbook Subsystems Packaging

Microelectronics Packaging Handbook Subsystems Packaging

Bibliographic Details
Other Authors: Tummala, Rao R., 1942- (Editor), RYMASZEWSKI, EUGENE J. (Editor), KLOPFENSTEIN, ALAN G. (Editor)
Format: Book
Language:Greek
Published: Boston Kluwer Academic Publishers 1997
Edition:2nd ed.
Subjects:
Μικροηλεκτρονική
HANDBOOK

ΒΚΠ - Πατρα: Reference Shelf

Holdings details from ΒΚΠ - Πατρα: Reference Shelf
Call Number: Π 621.381 046 HAN
Copy 1 Available

ΒΚΠ - Πατρα: ALFf

Holdings details from ΒΚΠ - Πατρα: ALFf
Call Number: 621.381 046 TUM
Copy 2 Available

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