IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...
Κύριοι συγγραφείς: | , , |
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Συγγραφή απο Οργανισμό/Αρχή: | |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Boston, MA :
Springer US,
2002.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- The Elmore Delay
- Higher-Order RC(L) Delay Metrics
- Asymptotic Waveform Evaluation
- Moment Generation
- Passive Reduced-Order Multiport Models
- Interfacing with SPICE
- Interfacing Interconnect and Gate-Delay Models.