IC Interconnect Analysis

As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...

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Bibliographic Details
Main Authors: Celik, Mustafa (Author), Pileggi, Lawrence (Author), Odabasioglu, Altan (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: Boston, MA : Springer US, 2002.
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ΒΚΠ - Πατρα: ALFd

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Call Number: 330.01 BAU
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ΒΚΠ - Πατρα: BSC

Holdings details from ΒΚΠ - Πατρα: BSC
Call Number: 330.01 BAU
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