Thermal and Power Management of Integrated Circuits

• Κύριοι συγγραφείς: Vassighi, Arman (Συγγραφέας), Sachdev, Manoj (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2006.
• Σειρά: Series on Integrated Circuits and Systems,
• Θέματα: Engineering.; Computer-aided engineering.; Engineering design.; Electrical engineering.; Electronic circuits.; Circuits and Systems.; Engineering Design.; Computer-Aided Engineering (CAD, CAE) and Design.; Electrical Engineering.

Thermal modeling of high performance circuits and systems is a crucial component for thermal and power management. The VLSI community is currently lacking a methodology to model and estimate junction temperature at any level of design other than low-level (transistor-level) circuits. The accuracy of...

Πίνακας περιεχομένων:

• Power, Junction Temperature, and Reliability
• Burn-in as a Reliability Screening Test
• Thermal and Electrothermal Modeling
• Thermal Runaway and Thermal Management
• Low Temperature CMOS Operation.