Springer Handbook of Experimental Solid Mechanics

The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line compu...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Sharpe, William N. (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Boston, MA : Springer US, 2008.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Part A Solid Mechanics Topics Chap. 1 Analytical Mechanics of Solids
  • Chap. 2 Materials Science for the Experimental Mechanist
  • Chap. 3 Polymers and Viscoelasticity
  • Chap. 4 Composite Materials
  • Chap. 5 Fracture Mechanics
  • Chap. 6 Active Materials
  • Chap. 7 Biological Soft Tissues
  • Chap. 8 Ionic Polymer-Metal Composites
  • Chap. 9 MEMS and NEMS
  • Chap. 10 Hybrid Methods. Chap. 11 Statistical Analysis of Experimental Data. Part B Contact Methods Chap. 12 Electrical Resistance Strain Gages
  • Chap. 13 Extensometers
  • Chap. 14 Fiber Strain Gages
  • Chap. 15 Residual Stress Measurement
  • Chap. 16 Nanoindentation
  • Chap. 17 Atomic Force Microscopy. Part C Noncontact Methods Chap. 18 Basics of Optics
  • Chap. 19 Image Analysis and Processing
  • Chap. 20 Digital Image Correlation
  • Chap. 21 Geometric Moiré
  • Chap. 22 Moiré Interferometry
  • Chap. 23 Speckle Methods
  • Chap. 24 Holography
  • Chap. 25 Photoelasticity
  • Chap. 26 Thermoelastic Stress Analysis
  • Chap. 27 Photoacoustic Characterization of Materials
  • Chap. 28 X-Ray Stress Analysis. Part D Applications Chap 29 Optical Methods
  • Chap. 30 Mechanical Testing at the Micro/Nano Scale
  • Chap. 31 Biological Tissue Testing
  • Chap. 32 Biomedical Devices and Biologically Inspired Materials
  • Chap. 33 High Strain Rate and Impact Testing
  • Chap. 34 Delamination Mechanics
  • Chap. 35 Structural Testing Applications
  • Chap. 36 Electronic Packaging.