Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Suhir, E. (Επιμελητής έκδοσης), Lee, Y. C. (Επιμελητής έκδοσης), Wong, C. P. (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2007.
• Θέματα: Engineering.; Solid state physics.; Spectroscopy.; Microscopy.; Engineering design.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Materials > Surfaces.; Thin films.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Engineering Design.; Solid State Physics.; Spectroscopy and Microscopy.; Surfaces and Interfaces, Thin Films.

 Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book. Topics addressed in the book include, but are not limited to, the following: physics and mechanics of polymer materials; underfills; electrically conductive adhesives; plastic packages of IC devices; flip-chip packages; wirebond interconnects and metallurgical interconnections for harsh environments; reliability and stress testing and accelerated life testing; solder joint materials and technologies as well as lead-free solder materials and joints; reliability of mobile electronic products, photonic materials, optical fibers and active and passive optical components; thermal phenomena in micro- and opto-electronic systems and thermal stresses; adhesion problems and solutions; thin film materials, physics and mechanics; photorefractive materials and devices; nanomaterials and nanotechnology; multiphysics modeling and optimization technologies; experimental methods and techniques; testing methods and techniques, subjected to thermal loading, stress analyses of processed silicon wafers, and many others. The book is intended as a reference source and as a manual for electrical, materials, mechanical, and reliability engineers, as well as applied physicists and materials scientists. The book will be an essential tool for all those who are involved or interested in state-of-the-art in the analysis, design and manufacturing of micro- and opto-electronic systems. 

 Materials Physics -- Polymer Materials Characterization, Modeling and Application -- Thermo-Optic Effects in Polymer Bragg Gratings -- Photorefractive Materials and Devices for Passive Components in WDM Systems -- Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability -- Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges -- Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems -- Materials Mechanics -- Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension -- Area Array Technology for High Reliability Applications -- Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections -- Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections -- Fatigue Life Assessment for Lead-Free Solder Joints -- Lead-Free Solder Materials: Design For Reliability -- Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures -- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods -- Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach -- Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension -- Dynamic Physical Reliability in Application to Photonic Materials -- High-Speed Tensile Testing of Optical Fibers— New Understanding for Reliability Prediction -- The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior -- Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems -- Physical Design -- Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results -- Probabilistic Physical Design of Fiber-Optic Structures -- The Wirebonded Interconnect: A Mainstay for Electronics -- Metallurgical Interconnections for Extreme High and Low Temperature Environments -- Design, Process, and Reliability of Wafer Level Packaging -- Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow -- Reliability and Packaging -- Fundamentals of Reliability and Stress Testing -- How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests -- Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique -- Interconnect Reliability Considerations in Portable Consumer Electronic Products -- MEMS Packaging and Reliability -- Advances in Optoelectronic Methodology for MOEMS Testing -- Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study -- Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board -- Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics -- Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials -- The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging -- Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications -- Adhesive Bonding of Passive Optical Components -- Electrically Conductive Adhesives: A Research Status Review -- Electrically Conductive Adhesives -- Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging -- Die Attach Quality Testing by Structure Function Evaluation -- Mechanical Behavior of Flip Chip Packages under Thermal Loading -- Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices.