Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and...
| Συγγραφή απο Οργανισμό/Αρχή: | |
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| Άλλοι συγγραφείς: | , , |
| Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Boston, MA :
Springer US,
2007.
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| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Materials Physics
- Polymer Materials Characterization, Modeling and Application
- Thermo-Optic Effects in Polymer Bragg Gratings
- Photorefractive Materials and Devices for Passive Components in WDM Systems
- Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability
- Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges
- Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems
- Materials Mechanics
- Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension
- Area Array Technology for High Reliability Applications
- Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections
- Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections
- Fatigue Life Assessment for Lead-Free Solder Joints
- Lead-Free Solder Materials: Design For Reliability
- Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures
- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods
- Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach
- Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension
- Dynamic Physical Reliability in Application to Photonic Materials
- High-Speed Tensile Testing of Optical Fibers— New Understanding for Reliability Prediction
- The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior
- Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems
- Physical Design
- Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results
- Probabilistic Physical Design of Fiber-Optic Structures
- The Wirebonded Interconnect: A Mainstay for Electronics
- Metallurgical Interconnections for Extreme High and Low Temperature Environments
- Design, Process, and Reliability of Wafer Level Packaging
- Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
- Reliability and Packaging
- Fundamentals of Reliability and Stress Testing
- How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests
- Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique
- Interconnect Reliability Considerations in Portable Consumer Electronic Products
- MEMS Packaging and Reliability
- Advances in Optoelectronic Methodology for MOEMS Testing
- Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study
- Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board
- Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics
- Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials
- The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging
- Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications
- Adhesive Bonding of Passive Optical Components
- Electrically Conductive Adhesives: A Research Status Review
- Electrically Conductive Adhesives
- Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging
- Die Attach Quality Testing by Structure Function Evaluation
- Mechanical Behavior of Flip Chip Packages under Thermal Loading
- Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices.
