Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...
Κύριος συγγραφέας: | Greig, William J. (Συγγραφέας) |
---|---|
Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Boston, MA :
Springer US,
2007.
|
Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Παρόμοια τεκμήρια
-
Integrated Circuit Packaging, Assembly and Interconnections
ανά: Greig, William J.
Έκδοση: (2007) -
Advanced Flip Chip Packaging
Έκδοση: (2013) -
Copper Interconnect Technology
ανά: Gupta, Tapan
Έκδοση: (2009) -
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability /
ανά: Lee, Tae-Kyu, κ.ά.
Έκδοση: (2015) -
Materials for Advanced Packaging
Έκδοση: (2017)