Integrated Circuit Packaging, Assembly and Interconnections

• Main Author: Greig, William J. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2007.
• Subjects: Engineering.; Engineering design.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Engineering Design.; Optical and Electronic Materials.

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials a...

Table of Contents:

• Electronic Manufacturing and the Integrated Circuit
• Integrated Circuit Manufacturing: A Technology Resource
• Packaging the IC—Single Chip Packaging
• The Chip Scale Package
• Multichip Packaging
• Known Good Die (KGD)
• Packaging Options—Chip on Board
• Chip & Wire Assembly
• Tape Automated Bonding—TAB
• Flip Chip—The Bumping Processes
• Flip Chip Assembly
• HDI Substrate Manufacturing Technologies: Thin Film Technology
• HDI Substrate Manufacturing Technologies: Thick Film Technology
• HDI Substrate Manufacturing Technologies: Cofired Ceramic
• Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.