Solder Joint Technology Materials, Properties, and Reliability /

• Κύριος συγγραφέας: Tu, King-Ning (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: New York, NY : Springer New York, 2007.
• Σειρά: Springer Series in Materials Science, 117
• Θέματα: Materials science.; Manufacturing industries.; Machines.; Tools.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Electronic circuits.; Metals.; Materials Science.; Metallic Materials.; Circuits and Systems.; Quality Control, Reliability, Safety and Risk.; Manufacturing, Machines, Tools.; Electronics and Microelectronics, Instrumentation.

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example...

Πίνακας περιεχομένων:

• Copper—Tin Reactions
• Copper–Tin Reactions in Bulk Samples
• Copper–Tin Reactions in Thin-Film Samples
• Copper–Tin Reactions in Flip Chip Solder Joints
• Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops
• Spontaneous Tin Whisker Growth: Mechanism and Prevention
• Solder Reactions on Nickel, Palladium, and Gold
• Electromigration and Thermomigration
• Fundamentals of Electromigration
• Electromigration in Flip Chip Solder Joints
• Polarity Effect of Electromigration on Solder Reactions
• Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration
• Thermomigration.