Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics /

• Κύριος συγγραφέας: Subramanian, K. N. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2007.
• Θέματα: Engineering.; Mechanical engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Materials science.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Materials Science, general.; Metallic Materials.; Quality Control, Reliability, Safety and Risk.; Mechanical Engineering.; Optical and Electronic Materials.

In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns, elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, until recently, solders used in electronics, based on suitab...

Πίνακας περιεχομένων:

• Thermodynamics and phase diagrams of lead-free solder materials
• Phase diagrams of Pb-free solders and their related materials systems
• The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
• Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
• Rare-earth additions to lead-free electronic solders
• Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders
• Sn-Zn low temperature solder
• Composite lead-free electronic solders
• Processing and material issues related to lead-free soldering
• Interfacial reaction issues for lead-free electronic solders
• Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
• Deformation behavior of tin and some tin alloys
• Mechanical fatigue of Sn-rich Pb-free solder alloys
• Life expectancies of Pb-free SAC solder interconnects in electronic hardware
• Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments
• Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
• Electromigration issues in lead-free solder joints
• Stress analysis of spontaneous Sn whisker growth
• Sn-whiskers: truths and myths
• Tin pest issues in lead-free electronic solders
• Issues related to the implementation of Pb-free electronic solders in consumer electronics
• Impact of the ROHS directive on high-performance electronic systems
• Impact of the ROHS Directive on high-performance electronic systems.