Lead-Free Soldering

The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substa...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Bath, Jasbir (Editor)
Format: Electronic eBook
Language:English
Published: Boston, MA : Springer US, 2007.
Subjects:
Online Access:Full Text via HEAL-Link
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300 |a XIV, 299 p.  |b online resource. 
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505 0 |a Lead Restrictions and Other Regulatory Influences on the Electronics Industry -- Fundamental Properties of Pb-Free Solder Alloys -- Lead-Free Surface Mount Assembly -- Lead-Free Wave Soldering -- Lead-Free Rework -- Lead-Free Solder Joint Reliability -- Backward and Forward Compatibility -- PCB Laminates -- Lead-Free Board Surface Finishes -- Lead-Free Soldering Standards. 
520 |a The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility. 
650 0 |a Engineering. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Electronic circuits. 
650 0 |a Environmental law. 
650 0 |a Environmental policy. 
650 0 |a Optical materials. 
650 0 |a Electronic materials. 
650 0 |a Metals. 
650 1 4 |a Engineering. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Metallic Materials. 
650 2 4 |a Circuits and Systems. 
650 2 4 |a Optical and Electronic Materials. 
650 2 4 |a Environmental Law/Policy/Ecojustice. 
700 1 |a Bath, Jasbir.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9780387324661 
856 4 0 |u http://dx.doi.org/10.1007/978-0-387-68422-2  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)