Micro-Assembly Technologies and Applications IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS’2008) Chamonix, France February 10–13, 2008 /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Ratchev, Svetan (Editor), Koelemeijer, Sandra (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2008.
• Series: IFIP — International Federation for Information Processing, 260
• Subjects: Engineering.; Artificial intelligence.; Electronic circuits.; Circuits and Systems.; Artificial Intelligence (incl. Robotics).; Information Systems Applications (incl. Internet).

International Federation for Information Processing The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications...