Solder Joint Reliability Prediction for Multiple Environments

• Main Authors: Perkins, Andrew E. (Author), Sitaraman, Suresh K. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2009.
• Subjects: Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Metallic Materials.; Optical and Electronic Materials.; Quality Control, Reliability, Safety and Risk.

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...