Solder Joint Reliability Prediction for Multiple Environments

• Main Authors: Perkins, Andrew E. (Author), Sitaraman, Suresh K. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US, 2009.
• Subjects: Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Metallic Materials.; Optical and Electronic Materials.; Quality Control, Reliability, Safety and Risk.

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...

Table of Contents:

• Background
• Literature Review
• Unified Finite Element Modeling for Prediction of Solder Joint Fatigue
• Validation of Unified FEM for Thermal Cycling and Power
• Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling
• Validation of Unified FEM and Development of Fatigue-life Equations for Vibration
• Universal Predictive Fatigue Life Equation and the Effect of Design Parameters
• Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages
• Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments
• Solder Joint Reliability Assessment for Desktop and Space Applications.