Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...

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Bibliographic Details
Main Authors: Perkins, Andrew E. (Author), Sitaraman, Suresh K. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: Boston, MA : Springer US, 2009.
Subjects:
Engineering.
Quality control.
Reliability.
Industrial safety.
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Metals.
Electronics and Microelectronics, Instrumentation.
Metallic Materials.
Optical and Electronic Materials.
Quality Control, Reliability, Safety and Risk.
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ΒΚΠ - Πατρα: ALFd

Holdings details from ΒΚΠ - Πατρα: ALFd
Call Number: 330.01 BAU
Copy 1 Available

ΒΚΠ - Πατρα: BSC

Holdings details from ΒΚΠ - Πατρα: BSC
Call Number: 330.01 BAU
Copy 2 Available
Copy 3 Available

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