Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

• Corporate Author: SpringerLink (Online service)
• Other Authors: Shacham-Diamand, Yosi (Editor), Osaka, Tetsuya (Editor), Datta, Madhav (Editor), Ohba, Takayuki (Editor)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York, 2009.
• Subjects: Chemistry.; Electrochemistry.; Chemical engineering.; Electrical engineering.; Materials science.; Nanotechnology.; Materials Science, general.; Industrial Chemistry/Chemical Engineering.; Electrical Engineering.

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...