Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Shacham-Diamand, Yosi (Editor), Osaka, Tetsuya (Editor), Datta, Madhav (Editor), Ohba, Takayuki (Editor)
Format: Electronic eBook
Language:English
Published: New York, NY : Springer New York, 2009.
Subjects:
Chemistry.
Electrochemistry.
Chemical engineering.
Electrical engineering.
Materials science.
Nanotechnology.
Materials Science, general.
Industrial Chemistry/Chemical Engineering.
Electrical Engineering.
Online Access:Full Text via HEAL-Link

Internet

Full Text via HEAL-Link

ΒΚΠ - Πατρα: ALFd

Holdings details from ΒΚΠ - Πατρα: ALFd
Call Number: 330.01 BAU
Copy 1 Available

ΒΚΠ - Πατρα: BSC

Holdings details from ΒΚΠ - Πατρα: BSC
Call Number: 330.01 BAU
Copy 2 Available
Copy 3 Available

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