The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Grossmann, Günter (Επιμελητής έκδοσης), Zardini, Christian (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: London : Springer London, 2011.
• Θέματα: Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Materials science.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Quality Control, Reliability, Safety and Risk.; Characterization and Evaluation of Materials.

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in l...

Πίνακας περιεχομένων:

• 1. Deformation and Fatigue of Solders
• 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints
• 3. Thermal Fatigue Analysis
• 4. Electrochemical Behavior of Solder Alloys
• 5. Void Formation by Kirkendall Effect in Solder Joints
• 6. Tin Whiskers
• 7. Electromigration in Solder Interconnects
• 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold
• 9. Reliability of Electronic Assemblies under Mechanical Shock Loading
• 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration
• 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates
• 12. PCB Delamination
• 13. Excessive Warpage of Large Packages during Reflow Soldering
• 14. Popcorn Cracking
• 15. Thermal Capability of Components.