Structural Integrity and Reliability in Electronics Enhancing Performance in a Lead-Free Environment /

• Main Authors: Plumbridge, W. J. (Author), Matela, R. J. (Author), Westwater, A. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Dordrecht : Springer Netherlands, 2003.
• Subjects: Engineering.; Mechanics.; Applied mathematics.; Engineering mathematics.; Manufacturing industries.; Machines.; Tools.; Civil engineering.; Materials science.; Civil Engineering.; Characterization and Evaluation of Materials.; Manufacturing, Machines, Tools.; Appl.Mathematics/Computational Methods of Engineering.

Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represe...

Table of Contents:

• Setting the Scene
• to the Properties of Materials
• More Complex Mechanical Behaviour
• Mechanical Testing (For Electronics Applications)
• Mechanical Properties of Bulk Solders
• Mechanical Behaviour of Solder Joints
• Electronic Components and Their Construction
• Printed Circuit Board Assembly Methods and Technologies
• Fundamentals of Failure Analysis
• Analysis of PCB and Electronic Component Failure
• Making the Transition to a Reliable Lead-free Solder Process
• to Life Prediction
• Life Prediction by Crack Propagation Approach
• Reliability and Statistical Analysis of Data
• Thermal and Mechanical Simulation in Microelectronics
• Finite Element Analysis
• Non-linear Finite Element Analysis
• Case Study.