Structural Integrity and Reliability in Electronics Enhancing Performance in a Lead-Free Environment /

• Κύριοι συγγραφείς: Plumbridge, W. J. (Συγγραφέας), Matela, R. J. (Συγγραφέας), Westwater, A. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands, 2003.
• Θέματα: Engineering.; Mechanics.; Applied mathematics.; Engineering mathematics.; Manufacturing industries.; Machines.; Tools.; Civil engineering.; Materials science.; Civil Engineering.; Characterization and Evaluation of Materials.; Manufacturing, Machines, Tools.; Appl.Mathematics/Computational Methods of Engineering.

Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represe...

Πίνακας περιεχομένων:

• Setting the Scene
• to the Properties of Materials
• More Complex Mechanical Behaviour
• Mechanical Testing (For Electronics Applications)
• Mechanical Properties of Bulk Solders
• Mechanical Behaviour of Solder Joints
• Electronic Components and Their Construction
• Printed Circuit Board Assembly Methods and Technologies
• Fundamentals of Failure Analysis
• Analysis of PCB and Electronic Component Failure
• Making the Transition to a Reliable Lead-free Solder Process
• to Life Prediction
• Life Prediction by Crack Propagation Approach
• Reliability and Statistical Analysis of Data
• Thermal and Mechanical Simulation in Microelectronics
• Finite Element Analysis
• Non-linear Finite Element Analysis
• Case Study.