Radio Design in Nanometer Technologies

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: ISMAIL, MOHAMMED (Επιμελητής έκδοσης), GONZÁLEZ, DELIA RODRÍGUEZ DE LLERA (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands, 2006.
• Θέματα: Engineering.; Electrical engineering.; Electronic circuits.; Nanotechnology.; Circuits and Systems.; Electrical Engineering.; Communications Engineering, Networks.

 Radio Design in Nanometer Technologies addresses current trends and future directions in radio design for wireless applications. As radio transceivers constitute the major bottleneck in a wireless chipset in terms of power consumption and die size, the radio must be designed in the context of the entire system, end to end. Therefore the book will address wireless systems as well as the DSP parts before it gets into coverage of radio design issues. As such, the book is the first volume that looks at the integrated radio design problem as a "piece of a big puzzle", namely the entire chipset or single chip that builds an entire wireless system. This is the only way to successfully design radios to meet the stringent demands of today’s increasingly complex wireless systems. 

 CURRENT AND FUTURE TRENDS -- “4G” AND THE WIRELESSWORLD 2015 – CHALLENGES IN SYSTEM ARCHITECTURES AND COMMUNICATION PARADIGMS -- CELLULAR RF REQUIREMENTS AND INTEGRATION TRENDS -- SOFTWARE DEFINED RADIO – VISIONS, CHALLENGES AND SOLUTIONS -- DIGITAL SOC DESIGN -- TRENDS IN SOC ARCHITECTURES -- PROGRAMMABLE BASEBAND PROCESSORS -- ANALOG-TO-DIGITAL CONVERSION TECHNOLOGIES FOR SOFTWARE DEFINED RADIOS -- RECONFIGURABLE A/D CONVERTERS FOR FLEXIBLE WIRELESS TRANSCEIVERS IN 4G RADIOS -- RADIO DESIGN -- RECEIVER DESIGN FOR INTEGRATED MULTI-STANDARD WIRELESS RADIOS -- ON-CHIP ESD PROTECTION FOR RFICS -- SILICON-BASED MILLIMETER-WAVE POWER AMPLIFIERS -- MONOLITHIC INDUCTOR MODELING AND OPTIMIZATION -- CHALLENGES IN THE DESIGN OF PLLS IN DEEP-SUBMICRON TECHNOLOGY -- RFIC DESIGN FOR FIRST-PASS SILICON SUCCESS.