Mechanics of Microelectronics
From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qual...
Συγγραφή απο Οργανισμό/Αρχή: | |
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Άλλοι συγγραφείς: | , , |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Dordrecht :
Springer Netherlands,
2006.
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Σειρά: | Solid mechanics and its applications,
141 |
Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Microelectronics Technology
- Reliability Practice
- Thermal Management
- to Advanced Mechanics
- Thermo-Mechanics of Integrated Circuits and Packages
- Characterization and Modelling of Moisture Behaviour
- Characterization and Modelling of Solder Joint Reliability
- Virtual Thermo-Mechanical Prototyping
- Challenges and Future Perspectives.