Mechanics of Microelectronics

• Corporate Author: SpringerLink (Online service)
• Other Authors: Zhang, G. Q. (Editor), Driel, W. D. Van (Editor), Fan, X. J. (Editor)
• Format: Electronic eBook
• Language: English
• Published: Dordrecht : Springer Netherlands, 2006.
• Series: Solid mechanics and its applications, 141
• Subjects: Engineering.; Computational intelligence.; Mechanics.; Mechanics, Applied.; Mechanical engineering.; Theoretical and Applied Mechanics.; Mechanical Engineering.; Computational Intelligence.

From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qual...

Table of Contents:

• Microelectronics Technology
• Reliability Practice
• Thermal Management
• to Advanced Mechanics
• Thermo-Mechanics of Integrated Circuits and Packages
• Characterization and Modelling of Moisture Behaviour
• Characterization and Modelling of Solder Joint Reliability
• Virtual Thermo-Mechanical Prototyping
• Challenges and Future Perspectives.