Advanced Wirebond Interconnection Technology

• Κύριος συγγραφέας: Prasad, Shankara K. (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2004.
• Θέματα: Engineering.; Manufacturing industries.; Machines.; Tools.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Manufacturing, Machines, Tools.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Optical and Electronic Materials.

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not...

Πίνακας περιεχομένων:

• Materials for Wire Bonding
• Bonding Equipment
• Process Technology
• Quality
• Reliability
• New Technologies and New Applications for Wire Bonding.