Nano-Bio- Electronic, Photonic and MEMS Packaging

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Wong, C.P (Επιμελητής έκδοσης), Moon, Kyoung-Sik (Επιμελητής έκδοσης), Li, Yi (Grace) (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2010.
• Έκδοση: 1.
• Θέματα: Materials science.; Electrochemistry.; Biophysics.; Biological physics.; Electronics.; Microelectronics.; Biomedical engineering.; Nanotechnology.; Materials Science.; Electronics and Microelectronics, Instrumentation.; Biomedical Engineering.; Biophysics and Biological Physics.

Nanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication...

Πίνακας περιεχομένων:

• Nanomaterials for Microelectronic and Bio-packaging
• Nano-conductive Adhesives for Nano-electronics Interconnection
• Biomimetic Lotus Effect Surfaces for Nanopackaging
• Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
• Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications
• 1D Nanowire Electrode Materials for Power Sources of Microelectronics
• Mechanical Energy Harvesting Using Wurtzite Nanowires
• Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
• to Nanoparticle-Based Integrated Passives
• Thermally Conductive Nanocomposites
• Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
• On-Chip Thermal Management and Hot-Spot Remediation
• Some Aspects of Microchannel Heat Transfer
• Nanoprobes for Live-Cell Gene Detection
• Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
• Packaging of Biomolecular and Chemical Microsensors
• Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
• Molecular Dynamics Applications in Packaging
• Nanoscale Deformation and Strain Analysis by AFM/DIC Technique
• Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.