Copper Interconnect Technology

• Main Author: Gupta, Tapan (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2009.
• Subjects: Engineering.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Nanotechnology.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Circuits and Systems.

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began t...

Table of Contents:

• Dielectric Materials
• Diffusion and Barrier Layers
• Pattern Generation
• Deposition Technologies of Materials for Cu-Interconnects
• The Copper Damascene Process and Chemical Mechanical Polishing
• Conduction and Electromigration
• Routing and Reliability.