Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Xie, Yuan (Επιμελητής έκδοσης), Cong, Jason (Επιμελητής έκδοσης), Sapatnekar, Sachin (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US, 2010.
• Σειρά: Integrated Circuits and Systems,
• Θέματα: Engineering.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Materials > Surfaces.; Thin films.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Surfaces and Interfaces, Thin Films.; Engineering, general.

This book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the read...

Πίνακας περιεχομένων:

• 3D Process Technology Considerations
• Thermal and Power Delivery Challenges in 3D ICs
• Thermal-Aware 3D Floorplan
• Thermal-Aware 3D Placement
• Thermal Via Insertion and Thermally Aware Routing in 3D ICs
• Three-Dimensional Microprocessor Design
• Three-Dimensional Network-on-Chip Architecture
• PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
• System-Level 3D IC Cost Analysis and Design Exploration.