Moisture Sensitivity of Plastic Packages of IC Devices

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Fan, X.J (Επιμελητής έκδοσης), Suhir, E. (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Boston, MA : Springer US : Imprint: Springer, 2010.
• Σειρά: Micro- and Opto-Electronic Materials, Structures, and Systems
• Θέματα: Engineering.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Engineering, general.

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...

Πίνακας περιεχομένων:

• Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging
• Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds
• Real-Time Characterization of Moisture Absorption and Desorption
• Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices
• Characterization of Hygroscopic Deformations by Moiré Interferometry
• Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques
• Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis
• Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages
• Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages
• Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections
• Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices
• Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices
• New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels
• Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages
• Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
• Industrial Applications of Moisture-Related Reliability Problems
• Underfill Selection Against Moisture in Flip Chip BGA Packages
• Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs)
• Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging
• Moisture-Driven Electromigrative Degradation in Microelectronic Packages
• Interfacial Moisture Diffusion: Molecular Dynamics Simulation and Experimental Evaluation.