Moisture Sensitivity of Plastic Packages of IC Devices

• Corporate Author: SpringerLink (Online service)
• Other Authors: Fan, X.J (Editor), Suhir, E. (Editor)
• Format: Electronic eBook
• Language: English
• Published: Boston, MA : Springer US : Imprint: Springer, 2010.
• Series: Micro- and Opto-Electronic Materials, Structures, and Systems
• Subjects: Engineering.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Engineering, general.

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industri...